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Single Layer Pcb Assembly Flying Probe Printed Circuit Board Soldering

Shenzhen Yideyi Technology Limited Company
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Single Layer Pcb Assembly Flying Probe Printed Circuit Board Soldering

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Brand Name : YDY

Model Number : Y-0014

Certification : CE ROHS FCC

Place of Origin : China

MOQ : 1pcs

Price : Negotiable

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 50000pcs/month

Delivery Time : 1-20 work days

Packaging Details : PCB: Vacuum Packing / PCBA: ESD Packing

Type : Circuit Card Assembly Manufacturing Circuit Contract Electronic Assembly

Board Thickness : 0.4mm-4mm

Solder mask : Green. Red. Blue. White. Black.Yellow

Function Test : 100% Functional Test

Max Aspect Ratio : 10:1

PIated Hole Tolerance : +/-3mil

Layer Count : 1Layer-32Layer

Min Line width/spacing external : 4.0mil/4.0mil

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Circuit Card Assembly Manufacturing Circuit Contract Electronic Assembly

Shenzhen YDY Technology Co., Ltd provided high quality printed circuit boards with remarkable speed and customer service.

As a professional and experienced printed circuit board manufacturer, we take great pride in delivering world-class products and customer service.

Our high-quality multilayer, double-sided and single sided printed circuit boards are supported by a dedicated staff with experience in all aspects of the PCB industry.

Our commitment to excellence doesn't stop at manufacturing circuit boards. Our reputation thrives on delivering high quality PCBs at the highest possible value- with quickness and care.

We can provide one-stop Pcb Assembly Service service:

1. High-end, Small volume and Various kinds of PCBA service offered;

2. Speedy, Flexible and one-stop service in PCBA;

3 Assembly and Purchasing service offered, all components are promisedpurchased 100% from Original factories or their pointed agents;

4. Transparent quotation,cost and benefit are detailedly opened to customer;

5. With professional Engineers and Long-term successful experience in cooperating with customers inland and overseas,all new projects can be developed faster and better than expected;

6. With USA or Japan imported tin cream and tin bar, and 100% AOI testing during production, all PCBAs we made are more reliable.

.

SMT Production Capabilities:


PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size:50x50mm
PCB Thickness:0.5mm-4.5mm
Board thickness:0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height:15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm

Production Capacity

Type
Rigid, Flexible, Rigid-Flexible
Material
FR4,94v0, CEM1, CEM3, Aluminum, High Frequency Board, etc.
Shape
Retangular, Round, Slots, Cutouts, Complex, Irregular
Cutting
Shear, V-score, Tab-routed
Board Thickness
0.2-4mm, regular 1.6mm,1.8mm
Copper Thickness
0.5-4oz, regular 1oz,1.5oz
Solder Mask
Green, Red, Blue, Yellow, etc.
Silk Screen
White, Black, etc
Silk Screen Min Line Width
0.006" or 0.15mm
Min Trace/Gap
0.1mm or 4mils
Min Drill Hole Diameter
0.01",0.25mm or 10mils
Surface Finish
HASL, ENIG, OSP,Gold finger,Au Panel etc.
Testing Service X-Ray/Flying Probe/E-test

Single Layer Pcb Assembly Flying Probe Printed Circuit Board Soldering

Quality Control

AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Micro BGAs
Chip scale packages
Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional
defects caused by component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

Single Layer Pcb Assembly Flying Probe Printed Circuit Board Soldering

Quality Assurance

Our operations have been accredited by ISO9001:2015, ISO13485:2016, ISO14001:2015 and IATF16949:2016.
We believe that we earn your continuous trust as Your reliable partner for EMS by always delivering products that meet or exceed your quality requirements. We employ a strict Quality Management System (QMS) to control the whole production process, so that quality is assured at every level of assembly.
Continual Improvemenis initiated through the use of quality policy, quality objective, analysis of data, corrective and preventive actions and management review. This requirement covers both the reactive and proactive action of improvement.
The reactive action are those actions taken to address nonconformities of products, processes and systems such as the correction taken on nonconformity or a defect and the follow-up corrective action to remove the root causes of the nonconformity. This is referred to as problem solving or problem resolution process and is a reactive action.

PCB Assembly application:

PCB Assembly is mainly appliable for the LED lighting, consumer electronics, medical devices, industrial applications, automotive applications, aerospace applications and so on.

Single Layer Pcb Assembly Flying Probe Printed Circuit Board Soldering
FAQ:

Q1. How do YDY keep your price competitive?
Over the last decade, prices of many raw materials (e.g. copper, chemicals) had doubled, tripled or quadrupled; Chinese currency RMB had appreciated 31% over US dollar; And our labor cost also increased significantly.
However, YDY have kept our pricing steady. This owns entirely to our innovations in reducing cost, avoiding wastes and improving efficiency. Our prices are very competitive in the industry at the same quality level.
We believe in a win-win partnership with our customers. Our partnership will be mutually beneficial if we can provide you an best cost and quality.

Q2. What kinds of boards can YDY process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

Q3. What data are needed for PCB & PCBA production?
1 BOM (Bill of Materials) with reference designators: component description, manufacturer’s name and part number.
2 PCB Gerber files.
3 PCB fabrication drawing and PCBA assembly drawing.
4 Test procedures.
5 Any mechanical restrictions such as assembly height requirements.


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